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Brochure (PDF) 2.5 MB

SPICE Modeling Service Questionnaires:

Bipolar

MOS

HVMOS

LDMOS

SOI

TFT

SPICE Modeling Services

Silvaco is an established leader in providing affordable and high quality SPICE modeling service with fast turnaround time.

Benefits

  • Leader in Supplying Accurate High Quality Spice Models
  • Aggressive in Providing Cost Effective Service with Rapid Turnaround
  • Extraction of accurate, high quality SPICE models for analog, digital, mixedmode and RF applications
  • All commercially available SPICE models supported
  • Extraction of DC, AC (s-parameters), Capacitance, Temperature, and Noise SPICE parameters
  • Either packaged parts or wafers are acceptable
  • Temperature range from -40°C to + 150°C
  • Model validation in accordance with Fabless Semiconductor Association (GSA), Compact Modeling Council, and IEEE test procedure #P1485 recommendations
  • Worst case and corner model generation

 

Complete SPICE Modeling Services

Silvaco provides SPICE modeling services for the semiconductor industry. We offer an experienced staff of engineers and state-of-the-art laboratory. Our services are affordable, and designed to provide the accuracy and rapid turn around time required by our customers.

Silvaco’s modeling services are ideally suited to either compliment in-house SPICE modeling capabilities when time is critical, or to provide complete SPICE modeling services for occasional needs. We support CMOS, Bipolar, Diode, JFET, GaAs SOI, TFT and HBT technologies, as well as technologies requiring the use of macro modeling.

Modeling service is performed by using UTMOST III and UTMOST IV modeling software: Automated data acquisition, SPICE model parameter extraction, Model validation and Model generation. First released in 1984, UTMOST III today is the established industry standard for SPICE parameter extraction. UTMOST IV is a new state-of-the-art optimization and SPICE modeling software.

SPICE Modeling Lab

Equipment List:

  • Probers
    • Cascade Microtech 12861 8 inch thermal attoguard prober (-40°C to 150°C)
    • Micromanipulator Model 6600 thermal 8 inch prober (room temperature to 150°C)
  • Temperature environment for packaged parts
    Tenney Jr environmental chamber (-40°C to 150°C)
  • DC Analyzers
    • HP4155 (4 SMU)
    • HP4155 (5 SMU)
    • HP4145
    • HP4142 (1x HCU, 2x HPSMU, 1x MPSMU)
  • LCR Analyzers
    • HP4284
    • HP4285
  • Network Analyzer
    HP8753 (6 GHz)
  • Dynamic Signal Analyzer
    HP3561
  • Digitizing Oscilloscope
    HP54501

Silvaco SPICE Modeling Services

MOS Technology

  • Typically ten to twelve NMOS and PMOS geometries are
    measured at specified temperature points for DC model
  • Area and sidewall junction capacitances, oxide capacitance and overlap capacitances are measured and parameters extracted
  • Extracted AC models are verified by measuring and simulating ring oscillator data
  • Complete noise characterization for noise voltage and noise current
  • Models available include Level 1,2,3, BSIM1, BSIM3, HV MOS Level 88, BSIM4, PSP, HiSIM HV, HiSIM and EKV

BIPOLAR Technology

  • DC, junction capacitances, AC (s-parameters), temperature measurements for DC
  • Models available include Gummel Poon, Mextram, VBIC
  • Macro models to include parasitic device effects

Other Supported Technologies

  • Diode: Level 1, 2, 3
  • TFT: Poly and Amorphous TFT models
  • SOI: BSIMSOI

Model Validation

  • Extracted model libraries are rigorously verified using external target SPICE and test circuits provided by the customer. At a minimum, measured ring oscillator period and switching ton/toff transient data is used

Deliverables

  • Measured versus simulated data plots provided as a hardcopy
  • SPICE formatted libraries
  • Raw measured data files can also be provided
  • Project report describing the data collection and modeling steps

Commercial Discrete Devices

  • Extensive and accurate SPICE models for discrete components from Motorola, Philips, NEC, Siliconix, etc. (over 7000 discrete parts)

SPICE Modeling Process Flow

Complete Solutions for your Modeling Needs

Rev. 060410_15

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