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Thermal3D

Thermal Packaging Simulator

Thermal3D is a general heatflow simulation module that predicts heatflow from any power generating devices (not limited to semiconductor devices), typically through a substrate and into the package and/or heatsink via the bonding medium. Operating temperatures for packaged and heat sinked devices or systems can be predicted for the design and optimization phase or for general system analysis.

Key Features

• Predicts heat flow and temperature rise for material systems and any number of heat generating sources
• Models validated using measured data
• Three models for heat dependent thermal conductivity to choose from for each of the materials in the system
• User definable thermal conductivities and coefficients for each material
• Very fast simulation times allow many combinations to be tried for system design optimization
• Seamlessly integrated into Silvaco’s device simulation software framework, ATLAS
• Industry leading, easy to use, multi-dimensional visualization tools for results analysis
• Interactive, user friendly and flexible runtime environment for quick result generation and analysis with numerous examples

Rev. 120707_04