HIPEX

1 Year Development Roadmap

• Provide single run extraction of multiple process corners
• Improve evaluation of coiled, semi-regular resistors with rounded bends
• Deploy context-based on-chip variation processing
• Introduce Grey-boxing and Black-boxing options of hierarchical RC-extraction
• Boost node probing performance for large designs
• Enhance contact clustering with flexible mode to improve extraction accuracy
• Support order specification for conductor layers
• Introduce options to increase performance on extracting parasitics from slotted layers

Last Revised 05/15/2012